产品信息

The AWB systems offer the versatility to perform

in-situ aligned bonding of 2” to 8” wafers using a

wide range of techniques:

Anodic, Eutectic, Direct (High & Low Temperature), Adhesive,

Solder, Thermo-compression, Glass frit and ‘iCAB’ in-situ

chemistry align & bond.

In-situ Chemistry: AML’s unique in-situ alignment and process

capabilities enable chemical preparation (for example, oxide

removal in Cu-Cu bonding) or activation of the bonding surfaces

immediately before alignment and wafer contact, without

exposure to air between stages.

INTEGRATED SYSTEM FOR ALIGNMENT AND BONDING:

  · In-situ alignment: 1 micron accuracy

  · Wafer sizes from 2” to 8” & chip bonding

  · Pressure: 10-6 mbar vacuum to 2 bar process gas  (UHV option also available)

  · Voltage: up to 2.5kV

  · Temperatures: up to 560°C - Wafers can be held at different temperatures

  · Contact force: up to 40kN

  · In-situ UV cure

  · Short cycle times: fast-bonding/high throughput