产品信息

Omega® Synapse™ etch process module uses a high density plasma source and is designed to etch strongly bonded materials.

Advantages of Synapse™

  · High MTBC - The process chamber can be heated to ~130ºC to reduce the amount 

    of by-product deposition and improve MTBC. The chamber is also surrounded by 

    permanent magnets which result in a higher plasma density than conventional ICPs 

    (by a factor of ~10x).

  · High Etch Rate – Higher plasma density means higher etch rate of strongly bonded 

    materials and the capability of running at reduced pressure. The latter extends 

    mean free paths and leads to better directionality and less by-product ‘fencing’.

  · Versalis-compatible – Can be fully integrated with different SPTS etch and 

    deposition modules on a Versalis cluster platform

Materials including…

  · SiO2 (including deep oxide etch >100 µm)

  · Glass

  · SiNx

  · SiC

  · GaN

  · PZT and AlN

  · Al2O3

With an installed base of >1200 DRIE process modules, Spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

Advantages of SPTS Si DRIE

  · High etch rate

  · Excellent uniformity

  · Controls tilting of deep features across the wafer

  · Inherent multi-mode flexibility also allows complementary oxide etching within the same hardware.

SPTS’s DRIE process modules are used in a wide variety of applications across multiple end markets.