产品信息

To address the requirements of both volume manufacturing, pilot production and R&D applications, SPTS offers their etch and deposition process technologies on a range of wafer-handling platform options:

fxP® - an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

c2L - a smaller production system for 3 – 8” wafers, supporting up to 3 process modules for flexibility and control. 

LPX - combines a manually-loaded, single wafer vacuum load-lock with SPTS etch or deposition plasma sources to produce a low-cost platform for low volume or R&D applications.

The fxP® is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

Available as a 4 – 8” system with vacuum cassettes that are compatible with SMIF robots or as an 8 – 12” system with an integrated EFEM.

The fxP platform is compatible with all SPTS's process modules, including Monarch 25 and Monarch 300 HF etch modules, and CVE XeF2 etch modules.

  · Omega® fxP - a cluster system supporting up to 6 plasma etch (ICP, DRIE, and/or Synapse) chambers

  · Mosaic™ fxP - a cluster system supporting up to 6 plasma dicing chambers

  · Primaxx® fxP - a cluster system supporting up to 6 Monarch 25 or Monarch 300 vapor HF etch chambers

  · Xactix® fxP - a cluster system supporting up to 6 CVE XeF2 etch chambers

  · Sigma® fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options) 

  · Delta™ fxP - a cluster system supporting up to 6 PECVD chambers

  · Versalis fxP® - a cluster system supporting a mixture of etch and deposition process chambers (up to 6 modules in total), useful for R&D 

    or pilot production, saving both capital expenditure and cleanroom footprint.

The c2L is an cost-effective cluster platform for low volume  or pilot production. It supports up to 3 process modules for flexibility and control, and is compatible system for 3 – 8” wafers. Using industry standard robotics and VCE cassette, the c2L is also available with SMIF as an option.

The c2L platform is compatible with all SPTS's process modules, including Monarch 25 and Monarch 300 HF etch modules, and CVE XeF2 etch modules.

  · Omega® c2L - a cluster system supporting up to 3 plasma etch (ICP, DRIE, and/or Synapse)      chambers

  · MosaicTM c2L - a cluster system supporting up to 3 plasma dicing chambers

  · Primaxx® c2L - a cluster system supporting up to 3 Monarch 25 vapor HF etch chambers

  · Xactix® c2L - a cluster system supporting up to 3 CVE XeF2 etch chambers

  · Sigma® c2L - a cluster system supporting up to 3 PVD chambers (including associated pre-

    clean/degas module options) 

  · DeltaTM c2L - a cluster system supporting up to 3 PECVD chambers

  · VersalisTM c2L - a cluster system supporting a mixture of etch and deposition process 

    chambers (up to 3 modules in total), useful for R&D or pilot production, saving both capital 

    expenditure and cleanroom footprint.

The LPX platform combines a manually-loaded, single wafer vacuum load-lock with SPTS etch or deposition plasma sources to produce a low-cost platform for R&D applications.