产品信息

Metal Deposition Technologies

  · Standard PVD – conventional sputter modules for low topography features

  · Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features

Markets Served by PVD

  · MEMS

  · Advanced Packaging

  · Power Semiconductors

  · Photonics

  · RF-IC

The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD

Metal Deposition Technologies

  · Standard PVD – conventional sputter modules for low topography features

  · Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high 

    aspect ratio features

Advantages of SPTS PVD

  · Single wafer processing, improves yields and on-wafer performance, when 

    compared to batch processing.

  · Planar target with full face erosion

      avoids re-sputtering, reduces particle contamination

      improves target life

  · Rapid target change (<5mins), with common magnetron increases uptime

  · Reliable handling of fragile, thinned or bowed wafers

  · "Super Uniformity" option available for specialist applications

  · Multi-wafer degas to increase throughput for long (low temp) degas applications

  · Common software for 200mm and 300mm systems - ease of use